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Philips Semiconductors 1N5060 - 1N5060 (Philips Semiconductors) - Controlled avalanche rectifiers
| Наименование: | 1N5060 |
|---|---|
| Производитель: | Philips Semiconductors |
| Файл: | 1N5060_Philips Semiconductors.pdf |
| Скачать datasheet: |
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| Описание: | DISCRETE SEMICONDUCTORS DATA SHEET handbook, 2 columns M3D116 1N5059 to 1N5062 Controlled avalanche rectifiers Product speciп¬Ѓcation Supersedes data of April 1992 File under Discrete Semiconductors, SC01 1996 Jun 19 Philips Semiconductors Product speciп¬Ѓcation Controlled avalanche rectiп¬Ѓers FEATURES • Glass passivated • High maximum operating temperature • Low leakage current • Excellent stability • Guaranteed avalanche energy absorption capability • Available in ammo-pack. DESCRIPTION 1N5059 to 1N5062 Rugged glass package, using a high temperature alloyed construction. 2/3 page k (Datasheet) LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 134). SYMBOL VRRM 1N5059 1N5060 1N5061 1N5062 VRWM crest working reverse voltage 1N5059 1N5060 1N5061 1N5062 VR continuous reverse voltage 1N5059 1N5060 1N5061 1N5062 IF(AV) average forward current PARAMETER repetitive peak reverse voltage This package is hermetically sealed and fatigue free as coefficients of expansion of all used parts are matched. a MAM047 Fig.1 Simplified outline (SOD57) and symbol. CONDITIONS MIN. в€’ в€’ в€’ в€’ в€’ в€’ в€’ в€’ в€’ в€’ в€’ в€’ MAX. 200 400 600 800 200 400 600 800 200 400 600 800 2.0 V V V V V V V V V V V V A UNIT Ttp = 45 В°C; lead length = 10 mm; averaged over any 20 ms period; see Figs 2 and 4 Tamb = 80 В°C; PCB mounting (see Fig.9); averaged over any 20 ms period; see Figs 3 and 4 в€’ в€’ 0.8 A IFSM ERSM Tstg Tj non-repetitive peak forward current non-repetitive peak reverse avalanche energy storage temperature junction temperature t = 10 ms half sinewave L = 120 mH; Tj = Tj max prior to surge; inductive load switched off see Fig.5 в€’ в€’ в€’65 в€’65 50 20 +175 +175 A mJ В°C В°C 1996 Jun 19 2 Philips Semiconductors Product speciп¬Ѓcation Controlled avalanche rectiп¬Ѓers ELECTRICAL CHARACTERISTICS Tj = 25 В°C; unless otherwise speciп¬Ѓed. SYMBOL VF V(BR)R PARAMETER forward voltage reverse avalanche breakdown voltage 1N5059 1N5060 1N5061 1N5062 IR trr Cd reverse current VR = VRRMmax; see Fig.7 VR = VRRMmax; Tj = 165 В°C; see Fig.7 reverse recovery time when switched from IF = 0.5 A to IR = 1 A; measured at IR = 0.25 A; see Fig.10 diode capacitance VR = 0 V; f = 1 MHz; see Fig.8 CONDITIONS IF = 1 A; Tj = Tj max; see Fig.6 IF = 1 A; see Fig.6 IR = 0.1 mA 225 450 650 900 в€’ в€’ в€’ в€’ MIN. в€’ в€’ 1N5059 to 1N5062 TYP. в€’ в€’ MAX. 0.8 1.0 UNIT V V в€’ в€’ в€’ в€’ в€’ в€’ 3 50 в€’ в€’ в€’ в€’ 1 150 в€’ в€’ V V V V ВµA ВµA Вµs pF THERMAL CHARACTERISTICS SYMBOL Rth j-tp Rth j-a Note 1. Device mounted on epoxy-glass printed-circuit board, 1.5 mm thick; thickness of copper ≥40 Вµm, see Fig.9. For more information please refer to the “General Part of Handbook SC01”. PARAMETER thermal resistance from junction to tie-point thermal resistance from junction to ambient note 1 CONDITIONS lead length = 10 mm VALUE 46 100 UNIT K/W K/W 1996 Jun 19 3 Philips Semiconductors Product speciп¬Ѓcation Controlled avalanche rectiп¬Ѓers GRAPHICAL DATA MBG044 1N5059 to 1N5062 handbook, halfpage 3 handbook, halfpage 1.6 MBG054 IF(AV) (A) 2 IF(AV) (A) 1.2 0.8 1 0.4 0 0 40 80 120 160 200 Ttp (В°C) 0 0 40 80 120 200 160 Tamb (В°C) a = 1.57; VR = VRRMmax; Оґ = 0.5. Lead length 10 mm. a = 1.57; VR = VRRMmax; Оґ = 0.5. Device mounted as shown in Fig.9. Fig.2 Maximum permissible average forward current as a function of tie-point temperature (including losses due to reverse leakage). Fig.3 Maximum permissible average forward current as a function of ambient temperature (including losses due to reverse leakage). MGC745 handbook, halfpage 4 handbook, halfpage 200 MBH388 P (W) 3 2.5 2 1.57 1.42 Tj (В°C) 2 a=3 100 59 60 61 62 1 0 0 1 2 IF(AV) (A) 3 0 0 400 800 VR (V) 1200 a = IF(RMS)/IF(AV); VR = VRRMmax; Оґ = 0.5. Fig.4 Maximum steady state power dissipation (forward plus leakage current losses, excluding switching losses) as a function of average forward current. Solid line = VR. Dotted line = VRRM; Оґ = 0.5. Fig.5 Maximum permissible junction temperature as a function of reverse voltage. 1996 Jun 19 4 Philips Semiconductors Product speciп¬Ѓcation Controlled avalanche rectiп¬Ѓers 1N5059 to 1N5062 MGC735 MGC734 handbook, halfpage 15 10 3 handbook, halfpage IR (ВµA) 10 2 IF (A) 10 max 10 5 1 0 0 1 VF (V) 2 10 в€’1 0 40 80 120 160 Tj (oC) 200 Solid line: Tj = 25 В°C. Dotted line: Tj = 175 В°C. VR = VRRMmax. Fig.6 Forward current as a function of forward voltage; maximum values. Fig.7 Reverse current as a function of junction temperature; maximum values. 10 2 handbook, halfpage MBG031 handbook, halfpage 50 25 Cd (pF) 7 10 50 2 3 1 10 VR (V) 10 2 MGA200 1 f = 1 MHz; Tj = 25 В°C. Dimensions in mm. Fig.8 Diode capacitance as a function of reverse voltage; typical values. Fig.9 Device mounted on a printed-circuit board. 1996 Jun 19 5 Philips Semiconductors Product speciп¬Ѓcation Controlled avalanche rectiп¬Ѓers 1N5059 to 1N5062 handbook, full pagewidth DUT + IF (A) 0.5 1Ω t rr 10 Ω 25 V 50 Ω 0 0.25 0.5 IR (A) 1.0 t MAM057 Input impedance oscilloscope: 1 MΩ, 22 pF; tr ≤ 7 ns. Source impedance: 50 Ω; tr ≤ 15 ns. Fig.10 Test circuit and reverse recovery time waveform and definition. 1996 Jun 19 6 Philips Semiconductors Product speciп¬Ѓcation Controlled avalanche rectiп¬Ѓers PACKAGE OUTLINE handbook, full pagewidth k 3.81 max 28 min Dimensions in mm. , 4.57 max 1N5059 to 1N5062 a 0.81 max 28 min MBC880 Fig.11 SOD57. DEFINITIONS Data sheet status Objective speciп¬Ѓcation Preliminary speciп¬Ѓcation Product speciп¬Ѓcation Limiting values Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the speciп¬Ѓcation is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the speciп¬Ѓcation. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. This data sheet contains target or goal speciп¬Ѓcations for product development. This data sheet contains preliminary data; supplementary data may be published later. This data sheet contains п¬Ѓnal product speciп¬Ѓcations. 1996 Jun 19 7 |
