Datasheet, поиск datasheets, архив даташитов по электронным компонентам
Для поиска datasheets (документации) по электронным компонентам воспользуйтесь приведенной ниже формой или ссылками для быстрого поиска datasheet по алфавиту. Наша база содержит более 1 000 000 даташитов в виде pdf-файлов доступных для закачки. Если вы не нашли нужного Вам datasheet, обратитесь к администрации проекта или воспользуйтесь форумом по поиску даташитов и документации по электронным компонентам. Надеемся, что наш архив datasheet и документации по электронным компонентам поможет вам найти необходимую вам документацию.
Более 1 000 000 datasheetsнапример: LM317
Panasonic Semiconductor 2SK0601 - 2SK0601 (Panasonic Semiconductor) - Silicon N-Channel MOS FET
Наименование:
2SK0601
Производитель:
Panasonic Semiconductor
Файл:
2SK0601_Panasonic Semiconductor.pdf
Скачать datasheet:
Описание:
Silicon MOS FETs (Small Signal)
2SK601
Silicon N-Channel MOS FET
For switching
unit: mm
s Features
q Low ON-resistance RDS(on) q High-speed switching q Allowing to be driven directly by CMOS and TTL q Mini-power type package, allowing downsizing of the sets and automatic insertion through the tape/magazine packing.
2.6В±0.1
4.5В±0.1 1.6В±0.2
1.5В±0.1
0.4max.
45Лљ
1.0–0.2
+0.1
0.4В±0.08
4.0–0.20
s Absolute Maximum Ratings (Ta = 25В°C)
Parameter Drain to Source voltage Gate to Source voltage Drain current Max drain current Allowable power dissipation Channel temperature Storage temperature
*
0.5В±0.08 1.5В±0.1 3.0В±0.15
0.4В±0.04
Symbol VDS VGSO ID IDP PD
*
Ratings 80 20 В±0.5 В±1 1 150 в€’55 to +150
Unit
3 2 1
V V A A W В°C В°C
1: Gate 2: Drain 3: Source EIAJ: SC-62 Mini-Power Type Package (3-pin)
marking
Tch Tstg
Marking Symbol: O
PC board: Copper foil of the drain portion should have a area of 1cm2 or more and the board thickness should be 1.7mm.
s Electrical Characteristics (Ta = 25В°C)
Parameter Drain to Source cut-off current Gate to Source leakage current Drain to Source breakdown voltage Gate threshold voltage Drain to Source ON-resistance Forward transfer admittance Symbol IDSS IGSS VDSS Vth RDS(on) | Yfs | Coss ton*2 toff
*2 *1
Conditions VDS = 60V, VGS = 0 VGS = 20V, VDS = 0 IDS = 100ВµA, VGS = 0 ID = 1mA, VDS = VGS ID = 0.5A, VGS = 10V ID = 0.2A, VDS = 15V, f = 1kHz VDS = 10V, VGS = 0, f = 1MHz
min
typ
max 10 0.1
Unit ВµA ВµA V
80 1.5 2 300 45 30 8 15 20 3.5 4
V Ω mS pF pF pF ns ns
Input capacitance (Common Source) Ciss Output capacitance (Common Source) Reverse transfer capacitance (Common Source) Crss Turn-on time Turn-off time
*1 *2
Pulse measurement ton, toff measurement circuit
Vout Vin = 10V 68Ω VDD = 30V Vout Vin 10% Vin 10% 90%
90% V
t = 1ВµS f = 1MHZ
out
50Ω
ton
toff
2.5В±0.1
+0.25
1
Silicon MOS FETs (Small Signal)
PD пЈ§ Ta
1.6 1.2 Copper foil of the drain portion should have a area of 1cm2 or more and the board thickness should be 1.7mm. Ta=25ЛљC 1.0 VGS=5.5V 1.0
2SK601
ID пЈ§ VDS
1.2 VDS=10V Ta=25ЛљC
ID пЈ§ VGS
Allowable power dissipation PD (W)
1.4 1.2 1.0 0.8 0.6 0.4 0.2 0 0 20 40
Drain current ID (A)
0.8
5V
Drain current ID (A)
0.8
0.6
4.5V
0.6
0.4
4V
0.4
3.5V 0.2 3V 0 60 80 100 120 140 160 0 2 4 6 8 10 0 0 2 4 6 8 10 0.2
Ambient temperature Ta (ЛљC)
Drain to source voltage VDS (V)
Gate to source voltage VGS (V)
| Yfs | пЈ§ VGS
Input capacitance (Common source), Output capacitance (Common source), Reverse transfer capacitance (Common source) Ciss,Coss,Crss (pF)
600
Ciss, Coss, Crss пЈ§ VDS
VDS=15V f=1kHz Ta=25ЛљC VGS=0 f=1MHz Ta=25ЛљC
RDS(on) пЈ§ VGS
Drain to source ON-resistance RDS(on) (Ω)
6 ID=500mA 5
120
Forward transfer admittance |Yfs| (mS)
500
100
400
80
4
300
60
3 Ta=75˚C 2 25˚C –25˚C
200
40
Ciss
100
20 Coss 0 1 3 10 30 Crss 100 300 1000
1
0 0 1 2 3 4 5 6
0 0 4 8 12 16 20
Gate to source voltage VGS (V)
Drain to source voltage VDS (V)
Gate to source voltage VGS (V)
RDS(on) пЈ§ Ta
Drain to source ON-resistance RDS(on) (Ω)
6 ID=500mA 5
4 VGS=5V
3
10V 2
1
0 –50
–25
0
25
50
75
Ambient temperature Ta (ЛљC)
2