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Latest Electronics News and Product Design Updates from New Electronics

 
Electronics News

Archive : 2015 год



07.07.2015 - 20:13
RF silicon on insulator (SOI) pioneer Peregrine Semiconductor has announced UltraCMOS 11, said to be the industry's first RF SOI technology. By moving to 300mm wafers, the company says it is opening the door to new enhancements and advanced features in future generations of the UltraCMOS technology platform."For more than 25 years, Per...
07.07.2015 - 20:09
Cyber attacks are said to cost UK businesses £18billion in lost revenue and £16billion in increased IT spending per year as a result of breaches. This causes reputation and brand damage due to customer data loss and lost revenue due to down time. According to the Information Security Breaches Survey, put together by the Centre of Econom...
05.07.2015 - 23:32
Imec has announced that it and its partners have completed a three-year programme to make a variety of silicon photonics technologies accessible for industry and academia worldwide. Within the ESSenTIAL programme, funded by the European Commission, imec has worked to develop advanced multi-project-wafer services (MPW) and packaging services for sil...
05.07.2015 - 23:29
Altera has joined the Open Platform for NFV (OPNFV), a community-led, industry-supported, open-source reference platform for network function virtualisation (NFV). NFV uses IT technologies to virtualise entire classes of network node functions into building blocks that may be connected, or chained, to create communication services.Joining worki...
05.07.2015 - 23:25
Looking to improve performance and reduce the risks of overheating, South Korean researchers at Pohang University have created a lithium-ion battery made from a porous solid.The new battery is built from pumpkin shaped molecules called cucurbit[6]uril – or CB[6]. These molecules are organised in a honeycomb like structure. The molecules h...
02.07.2015 - 23:14
University of Southampton researchers are to trial new techniques to produce optical fibre using additive manufacturing. This new way of making fibre could pave the way for more complex structures capable of unlocking applications in a range of industries, from biotechnology to aerospace and telecommunications.Current techniques used to produce...
02.07.2015 - 23:10
Xilinx has taped out an UltraScale+ MPSoC on TSMC's 16FF+ process, an event that appears to be adhering to the schedule outlined by the company earlier this year.The part integrates seven user programmable processors, including a quad core 64bit Cortex-A53 application processing unit, a dual core 32bit Cortex-R5 real time processing unit an...
02.07.2015 - 23:06
GreenPeak Technologies has announced the GP712, said to be the industry's first single radio multi-protocol chipset with multi-channel receive capability for set-top boxes, gateways, and other advanced IoT devices.As ZigBee is the dominant communication technology for wireless sensor networks and Thread is expected to become a prevailing pl...
01.07.2015 - 23:25
Following the announcement in October 2014 of its intention to buy IBM's microelectronics business, Globalfoundries has now completed the transaction."Today, we have significantly enhanced our technology development capabilities and reinforce our long term commitment to investing in R&D for technology leadership," said Sanjay...
01.07.2015 - 23:22
An international team of researchers, including scientists from Sungkyunkwan University in South Korea, has devised a technique for creating an micro supercapacitor (MSC) that delivers high electrochemical performance.The team modelled the film structure of its MSC on natural vein-textured leaves in order to take advantage of the natural transp...

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