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Latest Electronics News and Product Design Updates from New Electronics

Electronics News

Archive : March 2015 год



31.03.2015 - 21:29
IBM is to invest $3billion over the next four years to establish a new Internet of Things (IoT) unit. It will also build a cloud based open platform to help clients and ecosystem partners across industries better integrate real-time data from dispersed sources directly into business operations. "Our knowledge of the world grows with e...
31.03.2015 - 21:26
Micron Technology and Intel say a 256Gbit multilevel cell (MLC) version of their 3D NAND technology is now sampling, with a 384Gbit triple level cell (TLC) design to follow shortly. Initial production runs have started and both devices should be in full production by the end of 2015. Micron Technology and Intel say a 256Gbit multilevel cel...
31.03.2015 - 21:23
Circuit protection specialist Littelfuse has added an ESD option to its iDesign online simulation and product selection tool. Introduced in 2014 to assist in fuse selection, iDesign now helps circuit designers to select the best TVS Diode Arrays for their application.Users of the ESD selection tool enter parameters on the system settings and de...
31.03.2015 - 21:18
Farmell element14 has unveiled the GIZMO Explorer board, said to be a companion board for the GIZMO 2 platform. The board includes features and peripherals that suit it to use in motor control, human machine interface and control system designs.Farmell element14 has unveiled the GIZMO Explorer board, said to be a companion board for the GIZMO 2...
31.03.2015 - 21:14
Sheffield based SRAM developer sureCore is to collaborate with Belgian research centre imec on low power SRAM IP. Under the agreement, sureCore will license some of imec's SRAM design IP, whilst imec will make what is called a 'participation' in sureCore, which will establish an office in Leuven."This collaboration is strategic...
26.03.2015 - 21:04
Cypress has expanded the Traveo MCU family with the addition of a series said to provide a cost effective platform to deliver 2D and 3D graphics, as well as advanced functionality, for dashboards, head up displays and HVAC systems. Cypress has expanded the Traveo MCU family with the addition of a series said to provide a cost effective pla...
26.03.2015 - 21:01
Texas Instruments has launched an MCU range based on ARM's Cortex-M4F core. The MSP432 range is said to optimise performance without compromising power. According to the company, the MCUs consume 95µA/MHz in active mode and 850nA in standby.The MSP432 MCUs are said by TI to achieve a score of 167.4 on the ULPBench test – better...
26.03.2015 - 20:58
Toshiba says it has developed a 48 layer three dimensional stacked flash memory. Called BiCS, the 2bit/cell device has a capacity of 16Gbyte and is now sampling.BiCS is said to enhance write/erase endurance and to boost write speed. Although the technology can be used in a range of applications, Toshiba expects the parts to be used primarily in...
26.03.2015 - 20:53
Demand for MEMS devices grew by 5.7% in 2014, according to market researcher IHS, which identified Bosch as the leading supplier of the technology in a market driven by Apple. Claiming the market in 2014 was worth $9.45billion, IHS said Bosch held 12% of sales, worth $1.17bn.IHS analyst Jeremie Bouchard said Apple boosted Bosch's MEMS reven...
26.03.2015 - 20:50
Arrow Electronics says it will distribute a development platform and system on modules based on Qualcomm's Snapdragon 600 processor. According to the company, this will enable companies addressing the embedded and industrial sectors to develop applications such as security systems, robotics and motion control."Snapdragon processors are...