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Latest Electronics News and Product Design Updates from New Electronics

 
Electronics News

Archive : January 2016 год



08.01.2016 - 20:05
The Centre for Process Innovation (CPI) and Beneq have signed a long term collaboration agreement for the use of atomic layer deposition (ALD) technologies in printable electronics applications.The agreement brings together Beneq’s high precision vacuum coating alongside CPI’s capability in the scale up of printed electronics. Worki...
08.01.2016 - 20:02
Researchers at ETH Zurich have used a 3D print technology called Nanodrip to create a new type of transparent electrode, which takes the form of a grid made of gold or silver ‘nanowalls’ on a glass surface.The electrode is to have a higher conductivity and to be more transparent than those made of indium tin oxide, the material curr...
08.01.2016 - 19:59
A team of researchers from the University of Surrey’s Advanced Technology Institute (ATI) has grown vertically aligned carbon nanotubes (CNTs), in a grid-like formation on glass. The CNTs create wafer-thin, flat structures that could enable the miniaturisation of a range of optical devices. Removing the need for traditional curved refracting...
07.01.2016 - 23:52
Inuitive and Gestigon are collaborating to bring gesture recognition to embedded virtual reality (VR) platforms. The first stage of this collaboration will be demonstrated by both companies at CES 2016 in Las Vegas.Moritz Grotthuss, CEO of Gestigon, said: “Using today’s head-mounted VR displays, my hands are either not visible, or t...
07.01.2016 - 23:48
Said to be the smallest such device, a single chip 77GHz radar transceiver from NXP is claimed to enable the ‘next generation’ of radar sensor assemblies and to accelerate the adoption of advanced driver assistance systems (ADAS).The device, which measures 7.5 x 7.5mm, allows systems to be integrated ‘invisibly’ practica...
06.01.2016 - 21:23
Broadcom has launched a 64bit quad core processor for high end routers at CES. According to the company, the BCM4908 – which will be made on a 28nm process – enables OEMs and service providers to deliver the extra CPU power needed for smart home and IoT applications, whilst enabling higher Internet speeds.The BCM4908, which includes...
05.01.2016 - 23:33
Longsys Technology has used CES in Las Vegas to announce what it says is the smallest IoT WiFi silicon in package (SiP) module. The LTP0201 is designed for use in IoT and wearable devices that can connect to other smart devices or connect directly to the Internet.Measuring 6 x 6mm, the module integrates a 32bit RISC MCU, SRAM, SPI NOR flash, po...
05.01.2016 - 23:30
In experiments, a team of researchers from Osaka University claims to have detected Coulomb blockades in two dimensional organic conducting polymer films. The group says its work could change the conventional understanding of organic conductors and help in the design of organic and molecular devices, such as single-electron transistors or a memory...
05.01.2016 - 23:27
Rohde & Schwarz has launched its first handheld oscilloscope and claims the device – called Scope Rider – has the functionality and touch and feel of a state of the art lab device.Scope Rider integrates five instruments in a rugged housing. It features isolated input and communications interfaces, meets CAT IV standards and can...
04.01.2016 - 23:33
Scientists from the US National Institute of Standards and Technology (NIST) and IBM have determined that gold nanoparticles can be used to create straight paths in a range of III-V semiconductors. The discovery is said to be an ‘important addition’ to self assembly techniques.First, the team patterned the surface of indium phosphid...

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