Electronics News

Archive : April 2016 year

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Wearable NFC patch launched
14.04.2016 - 23:52

MC10, a US based healthcare technology company, has joined with design and manufacturing specialist PCH to commercialise the former’s Wearable Interactive Stamp Platform (WiSP). WISP, which is worn on the skin, is a stretchable and disposable stamp which is said to be just 0.05mm thick. When paired with a smartphone, tablet or NFC reade...

Leti, Qualcomm extend stacking technology deal
14.04.2016 - 23:44

French research institute Leti has extended its collaboration with Qualcomm Technologies under which the partners were developing CoolCube, the former’s sequential integration technology. Created by Leti as a way of creating high density, high performance circuits, CoolCube is said to eliminate the need for through silicon vias – ...

Slump in semiconductor revenues
14.04.2016 - 23:40

A report from market analyst IHS says demand for seniconductors fell in 2015 and could herald three years of weak growth. Sequential quarterly growth was weak throughout every quarter of 2015, especially in the first quarter, when the market declined 8.9% over the previous quarter. That drop represented the deepest sequential quarterly decline s...

h-BN helps Li-ion battery run at 150°C
14.04.2016 - 23:34

A combined electrolyte and separator for rechargeable lithium-ion batteries developed at Rice University in the US supplies energy at usable voltages and in high temperatures. An essential part of the non flammable, toothpaste-like composite is hexagonal boron nitride (h-BN), also known as ‘white graphene’. The team, led by materi...

Single stage process for touchscreen manufacture
11.04.2016 - 23:46

Research scientists at the Leibniz Institute for New Materials (INM) have developed a single stage process that allows conductive paths just a few microns wide to be created on carrier materials such as glass and flexible foils. Previously, says the team, manufacturing conductive paths was a time consuming process using several steps. The team b...

Quantum dots for better optoelectronic devices
11.04.2016 - 23:40

Harnessing solar power is said by researchers to require a material that not only absorbs light efficiently, but which also converts the energy to highly mobile electrical current. Looking to find this ‘ideal mix’ in a single material is a challenge, so scientists have been experimenting with ways to ‘hybrids’. Scienti...

Transistors made entirely of nanocrystal 'inks'
11.04.2016 - 23:33

Engineers from the University of Pennsylvania claim to have developed an approach for making transistors by sequentially depositing their components in the form of liquid nanocrystal ‘inks’. The researchers began by taking nanocrystals, or roughly spherical nanoscale particles, with the electrical qualities necessary for a transis...

Virtuoso platform now features advanced analogue verification technologies
11.04.2016 - 23:20

Cadence has unveiled its next-generation Virtuoso platform providing designers with significant performance and capacity improvements across the platform. New technologies within the Virtuoso Analogue Design Environment (ADE) and enhancements to the Virtuoso Layout Suite have been added to address changing requirements for automotive safety, med...

Vuforia augmented reality platform to support Microsoft HoloLens
02.04.2016 - 23:54

PTC has announced its Vuforia augmented reality (AR) platform will support Microsoft HoloLens. This capability has been demonstrated at Build 2016, Microsoft’s annual developer conference at San Francisco. Vuforia allows the HoloLens to connect experiences to specific things in the environment. This capability has been used to create 3D...

Consortium to develop world class NFC packaging capability for the UK
02.04.2016 - 23:51

The Centre for Process Innovation (CPI) is leading a consortium to create a UK manufacturing supply chain that aims to enable the widespread adoption of packaging incorporating Near-field Communication (NFC) based technology. The three year project, entitled ‘SCOPE’, is building the manufacturing capability, capacity and skills re...

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