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Photonics project aims to make communications ICs five times more efficient
02.03.2015 - 22:43

In a move to provide more communications bandwidth, Ireland based Tyndall National Institute will lead a consortium of European researchers in an EU funded project to develop intelligent circuits which can make photonic devices up to five times more efficient. The result, says the institute, will be faster data transmission at a lower cost. T...



Stadium Power sets up R&D centre in Norwich
02.03.2015 - 22:28

As part of the Stadium Group's strategy to become a leading design led technology business, Stadium Power has opened a standalone power product R&D centre in Norwich. The facility, on the Norwich Research Park, features a 1000sq ft laboratory and will be home to the company's engineering team, which is relocating from Diss. Ste...



NXP, Freescale to merge in $40billion deal
02.03.2015 - 22:25

NXP and Freescale have signed a definitive agreement under which NXP will merge with Freescale in a transaction which values the combined enterprise at $40billion. The deal values Freescale at $16.7billion, including its net debt. The merged entity will become the market leader in automotive semiconductor solutions and the market leader in ge...



Processor family pushes intelligence to the edge of the network
02.03.2015 - 22:21

Networking specialist Cavium has launched the OCTEON Fusion-M family that spans from a single chip macrocell baseband device to a part which can be used in smart radio heads. OCTEON Fusion-M processors are single chip solutions that target next generation radio. Key features are said to include optimised full custom processor cores, an effici...



Ink jet printed filter set to separate Terahertz frequencies
27.02.2015 - 21:57

University of Utah engineers have discovered a new approach for designing filters capable of separating different frequencies in the terahertz spectrum. According to the team, the filter – which can be produced using an ink jet printer – could allow mobile phone users and Internet surfers to download data 1000 times faster than today...



Electrocomponents names new chief executive
27.02.2015 - 21:47

Lindsley Ruth will take over as group chief executive of Electrocomponents with effect from 1 April 2015, replacing the incumbent Ian Mason. Lindsley Ruth will take over as group chief executive of Electrocomponents with effect from 1 April 2015, replacing the incumbent Ian Mason. Lindsley Ruth said: "I am excited about joining the te...



WiGig chipset to deliver 7Gbit/s using beam forming and antenna diversity
27.02.2015 - 21:43

Millimetre wave communications developer SiBeam has released the SB6501 and SB6510 UltraGig network processor and RF transceiver chipset. The IEEE802.11ad compliant chipset delivers up to 7Gbit/s in devices such as smartphones, tablets, ultrabooks, access points and wireless docks. UltraGig is said to take advantage of advanced beam forming t...



AMP consortium adds another power standard
27.02.2015 - 21:40

Building on the four standards it published at electronica in November 2014, the Architects of Modern Power (AMP) consortium has announced a further standard aimed at establishing common mechanical and electrical specifications for the development of advanced power conversion technology for distributed power systems. Called teraAMP, the stand...



Stabilised carbon could bring much higher energy densities for Li-ion batteries
27.02.2015 - 21:36

In order to allow an electric vehicle to travel for hundreds of miles at a time, lithium-ion batteries will have to have to store more energy, but keep the same size. However, according to a researcher, this is a dilemma as, in order to hold enough energy to enable a car to drive for 500 miles before recharging, current lithium-ion batteries bec...



EU project develops FET made from silicene
26.02.2015 - 21:33

A European research project says it has made an important step towards the further miniaturisation of nanoelectronics using silicene, a semiconducting material which combines the properties of silicon and graphene. "Electronics are currently embedded in many layers of silicon atoms," explained Dr Athanasios Dimoulas, coordinator of ...



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