Electronics News and Product Design Updates
13.11.2014 - 22:08
Expanding its line up of image recognition processors, Toshiba has announced the TMPV760, targeted at advanced driver assistance systems (ADAS). Supported by 14 hardware based image recognition accelerators, the device supports standard ADAS systems, including autonomous emergency braking, traffic light recognition, lane departure warning, la...
electronica 2014: IQD unveils GPS disciplined OCXO
13.11.2014 - 22:04
IQD's newest addition to its range of advanced oscillator modules is its IQCM-110 series of GPS disciplined OCXOs. Unveiled at electronica this week, the new design incorporates an internal GPS receiver with a 1PPS output and is housed in a 14pin 60mm square package. When coupled to an external aerial via the incorporated SMA con...
NI talks skills, the IoT and engineering’s ‘grand challenges’
13.11.2014 - 22:00
In his keynote address to NIDays, held last week in London, Eric Starkloff, vice president of global sales and marketing for National Instruments, said the Internet of Things (IoT) was not so much a technology, but more a 'convergence of technology'. He identified four main contributors: Moore's Law; wireless connectivity; sensor tec...
Spansion licenses Cortex-M7 for next gen MCUs
13.11.2014 - 21:57
Spansion has licensed ARM's Cortex-M7 processor for its new range of next generation MCUs and system solutions. "The new ARM Cortex-M7 processor will deliver advanced intelligence and energy efficiency for embedded applications," said Dhiraj Handa, senior vice president and general manager of Spansion's multi-market microcon...
Debug solution meets MIPI M-PHY v3.1 requirements
13.11.2014 - 21:53
Tektronix has introduced a physical layer transmitter characterisation and debug solution for the MIPI M-PHY v3.1 specification. The MSO/DPO70000DX oscilloscopes and P7600 TriMode probes include support for MIPI M-PHY High Speed Gears 1, 2 and 3, PWM Mode (G0-G7), and SYS Mode. They are claimed to offer the lowest noise performance i...
TI modules offer highest voltage protection
13.11.2014 - 21:49
Texas Instruments' new data converter and digital isolation families are designed to enable leading reinforced isolation ratings and precision performance for high voltage applications. The ISO7842 series of high immunity reinforced isolators can withstand an isolation barrier with a working breakdown voltage of 1,500Vrms for a minimum li...
Plessey demonstrates large GaN-on-Si LED die
13.11.2014 - 21:46
UK manufacturer Plessey has developed a large LED die based on its GaN-on-Silicon technology. Produced as a technology demonstrator, the die benefits from three core features: low thermal resistance, a single surface, emitter die design and 6in wafer processing. In addition, it utilises Plessey's vertical design structure, which ...
Headset paves way for wireless EEG monitoring
13.11.2014 - 21:43
A next generation, wireless electroencephalography (EEG) headset has been unveiled by imec and Holst Centre. The device combines dry electrodes with integrated skin-to-electrode impedance monitoring to provide information about the contact quality throughout the entire EEG recording. Signal processing is integrated to cancel out motion artefa...
electronica 2014: Tektronix demos six-in-one scope
13.11.2014 - 21:39
Visitors to the Tektronix stand at electronica will be able to get hands on with the world's first six-in-one oscilloscope. By combining six functions into the MDO3000, the company says it has integrated most of a designer's workbench needs into one instrument. Its research found that more than 25% of oscilloscope users also ...
electronica 2014: Digital power consortium unveils first standards
12.11.2014 - 22:06
The newly formed Architects of Modern Power (AMP) consortium – established by CUI, Ericsson Power Modules and Murata Power Solutions to address and define the future of intelligent, distributed, digital power ecosystems – has announced its first set of standards. The four standards, revealed at electronica in Munich, cover digital...
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