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SmartKEM gets Chinese patent allowance
02.08.2016 - 10:12

North Wales based SmartKem has received patent allowance in China for its semiconductor material. The company’s truFLEX platform can be used for manufacturing flexible displays and electronics and China is seen as a key future market. Steve Kelly, SmartKem’s CEO, said: QSuccessful collaboration is crucial in helping China to becom...

Graphene-like films from salts to boost nanoelectronics
02.08.2016 - 00:00

An international team of researchers has used computer simulations to find how thin a slab of salt has to be for it to break up into graphene-like layers. Dr Pavel Sorokin, from Moscow’s Technological Institute for Superhard and Novel Carbon Materials, explained: “This work has already attracted our colleagues from Israel and Japa...

Real-time chemical sensor to improve airport security
31.07.2016 - 12:43

A team of European scientists has created a hand-held chemical sensor capable of instantaneous detection from a distance of 30m. Harnessing new photonics technology, the mid-IR sensor uses spectroscopic sensors that read the unique frequencies, or ‘signatures’, given off when liquids or gases interact with light. Capable of a dete...

EU and Japan expand collaboration to create smart cities
31.07.2016 - 12:26

The EU-Japan ClouT – cloud of things – consortium has decided to add cities and partners to the recent BigClouT programme. The programme gives an analytics capability to the city by leveraging IoT, cloud and big data technologies creating a distributed intelligence that can be implanted in the whole city network. The new cities are G...

Adlink previews COM Express 3.0 Type 7 pin out
31.07.2016 - 12:19

Board developer Adlink Technology has released a preview of the Type 7 pin out for the COM Express standard, currently being updated to version 3.0. The new pinout brings 10Gbit Ethernet (GbE) capabilities to the format factor, with potential benefits in space constrained systems in industrial automation and data communication. The PICMG subc...

Toshiba moves to 64 layer flash memories
31.07.2016 - 12:11

Toshiba has announced the latest generation of BiCS FLASH, its 3D flash memory. The latest version is a 64 layer device that incorporates 3bit/cell technology, enabling 256Gbit to be stored. Toshiba says its next target is a 512Gbit device, also with 64 layers. Previously, Toshiba was producing a 48 layer device and the move to 64 layers is s...

Five years on; apprentices in the spotlight
31.07.2016 - 12:08

Five years ago, New Electronics reported on WorldSkills International. Organised by WorldSkills, a body that brings together industry, government, organisations, and institutions to promote skills education and training for young people, it was intended to promote awareness of the importance of apprenticeships and was the first time this event h...

Better capacity in high voltage lithium-ion batteries
31.07.2016 - 12:03

Researchers from the University of Tokyo, Kyoto University, JST PRESTO, and the National Institute for Materials Science, claim to have found a way to overcome capacity loss in lithium-ion batteries for electric vehicles. One way of improving driving range in electric cars running on lithium-ion batteries is by increasing the battery voltage ...

Nanolithia could advance battery technology, says MIT team
27.07.2016 - 10:37

While lithium-air batteries are seen to be promising for use in electric cars and portable electronic devices, they waste energy and degrade relatively quickly. A further constraint is their open cell configuration, which requires extra components to pump oxygen in and out. Despite these drawbacks, they hold the prospect of delivering high energ...

Altitude invests in Moortec
27.07.2016 - 10:34

Altitude Partners, the regional private equity fund, has completed a development capital investment into Moortec, a semiconductor Intellectual Property (IP) business supplying ‘in-chip’ monitoring circuits. Moortec’s IP technology serves tier one consumer, enterprise and automotive technology companies. Jonathan Simm, partne...

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