Peel packaging for Integrated Circuits
Farnell has introduced a new packaging solution for Integrated Circuits. Peel packaging offers complete protection to each individual component in transit, storage and handling by placing them within a protective, recyclable and biodegradable plastic cell which is then sealed with an anti-static lid. Peel packaging has been developed by Farnell in conjunction with Antistat. Initially, over 800 of Farnell’s most popular ICs with case sizes between 7mm x 7mm and 10mm x 10mm are being offered with the new packaging as standard. Product categories include: amplifiers, A to D converters, D to A converters, microcontrollers, and processors. Subsequent phases of the program will see peel packaging extended to a significant portion of the company’s complete IC product range.