RadioRadar - Datasheets, service manuals, circuits, electronics, components, CAD
Sitemap
Russian version
You read:

Radiotechnics, electronics, datasheets, service manuals, schematic diagrams

LAST UPDATES
12.01.2026 - 12:09 Near-field probes are essential tools for engineers working with electromagnetic compatibility (EMC). They allow precise detection of unwanted electromagnetic emissions directly on printed circuit boards (PCBs).What Are Near-Field Probes?Ne...
07.02.2023 - 22:39 When restoring vintage tube-type radios, it's essential to have a proper power input system. This system typically includes an isolation transformer, a Variac, and a current limiter. The Variac and current limiter protect the radio or other elect...
11.10.2021 - 23:36 IntroductionEvery electronic device you can consider containing a PCBis still the best and most reliable way of connecting electronics components. The PCB stands for Printed Circuit Board, on which electronic components are soldered on pads conne...
10.06.2020 - 23:19 TDA2822:The TDA2822 is a Dual Audio Amplifier IC, which means it has two Op-Amps inside its bundle, and they are normally utilized for sound intensification as a result of their wide data transfer capacity gain. The two yields can convey 250 mill...
09.06.2020 - 23:45 This amplifier is a combination of two amplifiers class A and class B. class B amplifier has a problem of distortion and class A amplifier has low efficiency problem. The class AB amplifier eliminates both of these problems and utilize the advantages...
06.05.2020 - 23:49 I have recently checked out www.utsource.net to order some parts for one of my projects. When you visit to the site’s home page it is prompted a part selection for multiple parts and also order placement links. In both methods parts have to be...
04.07.2018 - 03:18 A number of different communication modules for use with the Android I/O board have been introduced in various articles for the board. These modules have used WiFi, Bluetooth or USB. However, there is one module for the Android I/O board that's m...
06.11.2017 - 23:49 The building and tweaking of audio equipment is something that occupies many enthusiasts. It is very satisfying and nothing beats listening to music on equipment that you have built yourself, even partially. In this installment of WebScouting we'...
NEWS
28.01.2026 - 12:25

Nordic Semiconductor has announced its new nRF54L series, a wireless system-on-chip that embeds hardware-accelerated artificial intelligence into small, battery-operated industrial and consumer IoT devices. This new platform aims to run AI directly on the endpoint without draining power or overflowing memory.Block diagram of the nRF54L.Efficient On-Device AI with Axon NPUThe leading chip in the series, the nRF54LM20B, integrates an Axon Neural Processing Unit that accelera...

25.01.2026 - 11:46

At CES 2026, leading memory makers emphasized solving data movement challenges by boosting bandwidth, lowering power use, and improving reliability across storage and DRAM solutions.Micron’s New Gen5 QLC SSD for Thin Systems[Image: Micron 3610 SSD]Micron unveiled the 3610 NVMe SSD, promoted as the world’s first PCIe Gen5 client drive using its G9 QLC NAND technology. This SSD aims to give thin-and-light laptops and small form-factor PCs a big boost in both speed and...

23.01.2026 - 17:44

Cadence has introduced its sixth-generation digital signal processor IP, the Tensilica HiFi iQ DSP, designed specifically to meet the growing demands of voice artificial intelligence and advanced audio processing. The new DSP architecture delivers significantly higher performance while improving power efficiency for edge and embedded systems.Higher Performance for AI and Audio WorkloadsCompared to previous HiFi DSP generations, HiFi iQ offers:Up to 2× higher overall co...

21.01.2026 - 16:38

At CES 2026, Infineon Technologies has revealed a new chip family designed to streamline wireless connectivity for Internet of Things (IoT) devices. The AIROC ACW741x series is the first product in the industry to combine Wi-Fi 7, Bluetooth LE 6.0 and IEEE 802.15.4 Thread radios in a single device, while also supporting the Matter ecosystem for seamless interoperability. This integrated approach consolidates the most used wireless standards into one compact solution, helping engin...

16.01.2026 - 11:47

Siemens has announced the introduction of PAVE360 Automotive, a new category of digital twin software engineered to support development of software-defined vehicles (SDVs). The cloud-based solution aims to significantly shorten the time and effort automakers and suppliers need to build and test full vehicle systems virtually before physical prototypes are available. Conceptual view of a software-defined vehicle.Traditional automotive workflows often require actual hardware befor...

NEW SCHEMATIC DIAGRAMS AND SERVICE MANUALS