The ICs utilize an advanced high-voltage IC process platform, known as G5 HVIC, which enables a host of new features and enhancements. A next-generation high-voltage level-shifting and termination technology delivers superior electrical over-stress protection and higher field reliability. All G5 HVICs have passed extensive quality and reliability testing. Long-term reliability testing was performed to validate robustness beyond the expected useful lifetime of products in certain application environments. This qualification required the devices pass several stress conditions including a 2000 hour, high-temperature biased test. Additionally, the devices benefit from improvements in reliability due to silicon technology and packaging enhancements.
The advanced packaging equipment and materials, for example, combined with recent advancements in mold-compound injection techniques, allow these devices to be less sensitive to moisture and provide improvements in the plastic-to-die interface, an important consideration as peak soldering temperatures have increased with the adoption of lead-free soldering materials. The surface mount SO-8 packages are qualified to MSL2 (moisture sensitivity level 2) while all other surface mount packages are MSL3 qualified.