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Latest Electronics News and Product Design Updates from New Electronics

 
Electronics News

Archive : December 2014 год



22.12.2014 - 20:10
In a development which could help address the current data processing limitations of today's technology, a team of Stanford engineers has pioneered a scalable 3D computer chip that interconnects logic and memory.The researchers believe that with further work, the advance could enable large amounts of data to be processed quickly and more ef...
22.12.2014 - 20:05
Huawei, EE and Qualcomm have partnered for an LTE category 9 interoperability trial, claiming to have achieved download speeds of up to 410Mb/s.According to the partners, this represents a significant step forward in the industry's attempt to improve download speeds and reliability. Testing was conducted using QTI's Qualcomm Sn...
19.12.2014 - 22:43
Academics from the University of Southampton's Optoelectronics Research Centre (ORC) have collaborated with Eblana Photonics to develop an approach that enables advanced modulation format signals to be generated by the modulation of laser currents. The research, published in Nature Communications, explores a new approach to the generat...
19.12.2014 - 22:40
The Engineering and Physical Sciences Research Council (EPSRC) has announced funding for 10 research projects that are expected to develop new and exciting functional materials, as well as accelerate the application of the materials. The projects, which will involve 17 universities, are receiving funding of £32.1million. Welcoming th...
19.12.2014 - 22:36
Xilinx says its Kintex UltraScale KU040 FPGAs have moved into volume production on a 20nm process. "Xilinx is pleased to move the KU040 into full production," said Wouter Suverkropp, senior product line manager for Kintex FPGAs. "This milestone follows months of design work by our customers, leveraging the performance of the...
18.12.2014 - 21:34
Industry body NMI and the Electronic Systems Community (ESCO) have been given the opportunity to develop a new model for apprenticeships and are looking for industry support to define the scheme and get it off the ground. According to the partners: "We are acutely aware of the shortage of engineering skills and are proactive at addres...
18.12.2014 - 21:31
In a development that holds promise for future magnetic memory and logic devices, researchers in the US have successfully used an electric field to reverse the magnetisation direction in a multiferroic spintronic device at room temperature.The demonstration, made by a team from the US Department of Energy's Berkeley Lab, could lead to small...
18.12.2014 - 21:28
Resistive RAM pioneer Crossbar says it has developed a method which suppresses the sneak path current; an effect which makes it difficult to read data reliably from individual memory cells. Without this ability, the company says, RRAM developers cannot deliver high density 3D memory arrays. The company came out of 'stealth mode' ea...
18.12.2014 - 21:24
An ultra low power RFID transponder chip that operates from a supply of less than 1V was described by Belgian research centre imec at the recent IEDM conference. The device, created using thin film transistor technology (TFTs) on plastic film, is said to pave the way for such applications as item level RFID tagging, body area networks and environme...
18.12.2014 - 21:20
According to certification specialist SGS, the phrase that manufacturers and importers should avoid, as part of a disclosure, is 'to the best of my knowledge'. It says this seemingly innocent statement is often used to cover up a lack of objective evidence or, in the worst case, is an attempt to cover up a known lack of compliance or the fa...