Archive : 2026 год

Renesas revealed chiplet, power gating and 3-nm TCAM breakthroughs at ISSCC 2026, targeting ASIL D safety and AI performance in next-gen automotive SoCs.

Geehy has unveiled the G32A1425, a new automotive-grade microcontroller designed specifically for body control modules and comfort applications in new energy vehicles (NEVs).This device belongs to the G32A14xx family and is built on a 40 nm process. It features an Arm Cortex-M4F core with hardware floating-point unit, running at up to 112...

Malvern, PA – January 28, 2026 – Vishay Intertechnology, Inc. (NYSE: VSH) announced the launch of five new 1200 V silicon carbide (SiC) MOSFET power modules designed to boost power efficiency in medium- to high-frequency applications across automotive, energy, industrial, and telecom sectors.Vishay SiC MOSFET module in SOT-227...

Silanna Semiconductor has launched production of its innovative FirePower family - the SL2001 and SL2002 laser-firing system ICs. These devices are designed for LiDAR, time-of-flight (ToF), and rangefinding applications in automotive, industrial, and portable systems.According to the company, the SL2001 and SL2002 are the smallest and most effi...

Triad Semiconductor has launched the TS5510, a dual-channel analog front-end (AFE) low-noise programmable-gain amplifier for audio recording. The device suits both home and professional setups, delivering unmatched input flexibility.Enhanced Signal Matching and FlexibilityThe TS5510 can handle both high- and low-level audio inputs while...

 Power-Thru SiC Gate DriversAllegro MicroSystems has rolled out two power components aimed at improving efficiency and reducing noise and heat in demanding high-voltage systems. The new AHV85003/AHV85043 SiC gate driver chipset and the ACS37200 isolated current sensor address key challenges in modern power electronics used in elect...

Nordic Semiconductor has announced its new nRF54L series, a wireless system-on-chip that embeds hardware-accelerated artificial intelligence into small, battery-operated industrial and consumer IoT devices. This new platform aims to run AI directly on the endpoint without draining power or overflowing memory.Block diagram of the nRF5...

At CES 2026, leading memory makers emphasized solving data movement challenges by boosting bandwidth, lowering power use, and improving reliability across storage and DRAM solutions.Micron’s New Gen5 QLC SSD for Thin Systems[Image: Micron 3610 SSD]Micron unveiled the 3610 NVMe SSD, promoted as the world’s first PCIe Ge...

Cadence has introduced its sixth-generation digital signal processor IP, the Tensilica HiFi iQ DSP, designed specifically to meet the growing demands of voice artificial intelligence and advanced audio processing. The new DSP architecture delivers significantly higher performance while improving power efficiency for edge and embedded systems....

At CES 2026, Infineon Technologies has revealed a new chip family designed to streamline wireless connectivity for Internet of Things (IoT) devices. The AIROC ACW741x series is the first product in the industry to combine Wi-Fi 7, Bluetooth LE 6.0 and IEEE 802.15.4 Thread radios in a single device, while also supporting the Matter ecosystem for s...