Archive : 2026 год

Triad Semiconductor has launched the TS5510, a dual-channel analog front-end (AFE) low-noise programmable-gain amplifier for audio recording. The device suits both home and professional setups, delivering unmatched input flexibility.Enhanced Signal Matching and FlexibilityThe TS5510 can handle both high- and low-level audio inputs while...

 Power-Thru SiC Gate DriversAllegro MicroSystems has rolled out two power components aimed at improving efficiency and reducing noise and heat in demanding high-voltage systems. The new AHV85003/AHV85043 SiC gate driver chipset and the ACS37200 isolated current sensor address key challenges in modern power electronics used in elect...

Nordic Semiconductor has announced its new nRF54L series, a wireless system-on-chip that embeds hardware-accelerated artificial intelligence into small, battery-operated industrial and consumer IoT devices. This new platform aims to run AI directly on the endpoint without draining power or overflowing memory.Block diagram of the nRF5...

At CES 2026, leading memory makers emphasized solving data movement challenges by boosting bandwidth, lowering power use, and improving reliability across storage and DRAM solutions.Micron’s New Gen5 QLC SSD for Thin Systems[Image: Micron 3610 SSD]Micron unveiled the 3610 NVMe SSD, promoted as the world’s first PCIe Ge...

Cadence has introduced its sixth-generation digital signal processor IP, the Tensilica HiFi iQ DSP, designed specifically to meet the growing demands of voice artificial intelligence and advanced audio processing. The new DSP architecture delivers significantly higher performance while improving power efficiency for edge and embedded systems....

At CES 2026, Infineon Technologies has revealed a new chip family designed to streamline wireless connectivity for Internet of Things (IoT) devices. The AIROC ACW741x series is the first product in the industry to combine Wi-Fi 7, Bluetooth LE 6.0 and IEEE 802.15.4 Thread radios in a single device, while also supporting the Matter ecosystem for s...

Siemens has announced the introduction of PAVE360 Automotive, a new category of digital twin software engineered to support development of software-defined vehicles (SDVs). The cloud-based solution aims to significantly shorten the time and effort automakers and suppliers need to build and test full vehicle systems virtually before physical prototy...

Qualcomm has unveiled a new wave of artificial intelligence technologies, reinforcing its ambition to bring high-performance AI computing beyond smartphones and into personal computers, robotics, and automotive systems. The announcement highlights the company’s vision of on-device AI that operates efficiently without relying on constant cloud...

The new accelerated processing unit pairs with dual-band Wi-Fi 8 radios to deliver power-efficient, secure on-device AI inference to residential consumers.Broadcom used CES 2026 to roll out a unified Wi-Fi 8 silicon stack aimed at the next wave of “AI smart home” networking gear: a compute-heavy access point that can do more than rout...

Geehy Launches Encoder MCU for High-Precision Motion ControlGeehy has expanded its industrial microcontroller portfolio with the launch of the G32R430 series - a purpose-built encoder MCU designed for high-precision motion control applications. Unlike general-purpose microcontrollers, the G32R430 focuses on real-time encoder signal processing,...