Archive : 2026 год

congatec launches conga-TC300 COM Express Type 6 module with Intel Core Series 3 Wildcat Lake processors up to Core 7 350 for entry-level edge AI applications

ITECH launches IT8100A/E Series high-power DC electronic loads up to 1.8 MW with ultra-fast 150 A/μs slew rate. Designed for AI server power supplies, GPU testing, data centers, and EV charging systems

Siglent SNA6500A: New 6.5 GHz Vector Network Analyzer with excellent dynamic range and speed for RF component testing, 5G, Wi-Fi 6/7, and high-speed digital design

Diodes Inc introduces AL8853AQ — a multi-phase SPI boost controller designed for high-power automotive LED lighting, including matrix and adaptive driving beam (ADB) headlights

Microchip SAM9X75D5M: New hybrid MCU/MPU SiP with integrated DDR memory simplifies high-performance HMI designs for automotive digital clusters, EV chargers, and industrial applications

STMicroelectronics presents new automotive drivers: VNQ9050LAJ for robust 12V load control with advanced protection and STGAP2 isolated gate drivers for high-voltage EV power electronics

MIT introduces twin PUF technology: two chips share a unique silicon fingerprint for direct mutual authentication without external servers or stored keys — major advance in hardware security

Arduino Ventuno Q debuts as Qualcomm's first big Arduino product: 40 TOPS edge AI, dual-processor architecture for standalone robotics and generative models — release under $300 in Q2 2026

Siemens adds agentic AI to Questa One: autonomous agents speed RTL creation, verification planning, debug, and sign-off for complex IC designs — early access now open

AI-RAN integrates AI directly into RAN infrastructure, addressing traffic growth and unlocking AI-native 6G with shared computing, edge services, and major industry demos at MWC 2026