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Latest Electronics News and Product Design Updates from New Electronics

Electronics News

Archive : 2018 год

Atomically thin light-emitting device opens the possibility for 'invisible' displays
27.03.2018 - 23:35
A bright-light emitting device that is millimetres wide and fully transparent when turned off has been built by a team of engineers at the University of California (UC), Berkeley. The light emitting material is a monolayer semiconductor, which is just three atoms thick. According to the team, this discovery could pave the way in creating i...
Physicists reveal material for high-speed quantum internet
27.03.2018 - 23:28
As the race for quantum computing continues, so does the development into quantum technologies targeted to neturalise the threat of hacking.Classical cryptographic algorithms are complexity-based and can remain secure only for a certain period of time. Unlike its classical counterpart, quantum cryptography relies on the fundamental laws of phys...
Next-gen optical disk to solve data storage challenge
27.03.2018 - 23:20
Using gold nanomaterials combined with a hybrid glass material, scientists from from RMIT University and the Wuhan Institute of Technology say they have demonstrated a new type of high-capacity optical disk that can hold data securely for more than 600 years. This gold-generated next-generation optical disk is said to have up to 10TB c...
6SigmaET brings VR to thermal simulation
20.03.2018 - 23:04
Future Facilities has launched Release 12 of its thermal simulation software, 6SigmaET. The latest release incorporates a number of significant modelling enhancements that the company says will help to boost overall simulation speed.Release 12 includes a prototype virtual reality (VR) visualisation mode. In what it claims is a world first featu...
Xilinx looks beyond FPGAs and unveils new product category - ACAP
20.03.2018 - 22:58
Xilinx has announced, what it describes as, a new breakthrough product category called Adaptive Compute Acceleration Platform (ACAP) that provides capabilities significantly beyond that of an FPGA.An ACAP is a highly integrated multi-core heterogeneous compute platform that can be changed at the hardware level to adapt to the needs of a wide ra...
ByteSnap Design kick-starts Vehicle-to-Grid Intelligent Control project
20.03.2018 - 18:52
Electronics design consultancy ByteSnap Design and a consortium of partners have been awarded a two-year collaborative project VIGIL (Vehicle-to-Grid Intelligent Control) under a Vehicle-to-Grid (V2G) competition, funded by the Office for Low Emission Vehicles (OLEV) and the Department for Business Energy and Industrial Strategy (BEIS).ByteSnap...
5G chipset development
16.02.2018 - 23:36
A 5G test platform to help support test development for devices such as baseband chips has been announced by Anritsu.Working with Qualcomm Technologies, Anritsu says its platform, the next generation communication system beyond 4G LTE, is designed to support Qualcomm Technologies in an effort to commercialise next generation 5G NR technologies....
Scalable two-dimensional materials advance future-gen electronics
16.02.2018 - 23:31
The basis for growing wafer-scale two-dimensional crystals for future electronic devices has been published in two online nanotechnology journals.Growing high-quality, crystalline 2D materials at scale has proven to be a challenge, but a team of researchers, led by Professor Joan Redwing of the National Science Foundation and Penn State, claim...
Qualcomm unveils 2Gbit/s LTE modem
16.02.2018 - 23:23
Qualcomm Technologies has begun sampling the Qualcomm Snapdragon X24 LTE modem, the first Category 20 LTE modem to be announced that supports download speeds of up to 2Gbit/s. It is also the first-announced chip to be built on a 7nm FinFET process.This latest addition to Qualcomm’s modem stable is being seen as a continuation of the compa...
Cyber security solution for connected cars
16.02.2018 - 23:04
A partnership between Panasonic and Trend Micro has formed with a view to develop a cyber security solution to detect and prevent cyber-attacks against autonomous and connected cars.The duo aim to create a solution that will prevent intrusions into Electronic Control Units (ECUs) and in-vehicle infotainment devices (IVI).This partnership wi...

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