Electronics News
Archive : 5 May 2026 год
congatec has introduced the conga-TC300, a COM Express Type 6 Compact module designed as an entry-level edge AI solution. Powered by Intel Core Series 3 “Wildcat Lake” processors (up to the hexa-core Core 7 350), the module delivers a strong balance of performance, AI capabilities, and power efficiency at 15W TDP for demanding embedded applications.
congatec conga-TC300 COM Express Type 6 Compact module with Wildcat Lake processor
Processor Options
- Intel Core 7 350: 6 cores (2P + 4E), up to 4.6 GHz, 21 TOPS GPU, 17 TOPS NPU
- Intel Core 5 320: 6 cores, up to 4.6 GHz, 20 TOPS GPU, 16 TOPS NPU
- Intel Core 3 305: 6 cores, up to 4.3 GHz, 9 TOPS GPU
Key Specifications
- Up to 64 GB DDR5-6400 SO-DIMM memory
- Optional onboard UFS 3.1 storage
- Intel i226 2.5GbE controller with TSN support
- Display interfaces: up to 2x DDI (shared with USB4), LVDS or eDP
- Up to 2x USB4, 4x USB 3.2 Gen2, up to 8x USB 2.0
- PCIe: 4x Gen4 + optional 4x Gen3
- TPM 2.0 security, congatec Board Controller
- Dimensions: 95 × 95 mm (COM Express Compact)
Block diagram of congatec conga-TC300 COM Express module
Target Applications
The conga-TC300 is ideal for cost-sensitive edge AI applications including:
- Industrial automation and robotics
- Medical equipment
- Transportation and smart cities
- Retail / Point-of-Sale (POS) systems
It serves as a strong upgrade path from older Intel Atom or Celeron-based designs that now require dedicated AI acceleration.
The module supports Windows 11 IoT, Ubuntu Pro Linux, and various real-time/hypervisor solutions. Evaluation is possible with the conga-TEVAL carrier board.
conga-TEVAL COM Express carrier board for module evaluation
Source: CNX Software
ITECH has officially released the IT8100A/E Series - a new generation of high-speed, high-power DC electronic loads designed to meet the rapidly growing power testing demands of AI servers, GPU systems, data centers, EV charging equipment, and fuel cells. The platform emphasizes high power density, ultra-fast dynamic response, and scalable system configuration.
ITECH IT8100A/E Series high-power DC electronic loads
Key Capabilities
- Power density: Up to 7.2 kW in a compact 3U chassis
- System power: Up to 86.4 kW in one 37U cabinet, scalable to 1.8 MW in parallel operation
- Dynamic performance: Slew rate up to 150 A/μs for realistic transient testing
- Peak power capability: 1.5× short-term overpower mode
- Low-voltage high-current version: 60 V / 2400 A / 6 kW optimized for AI GPU power validation
The series is available in four voltage ranges: 60 V, 150 V, 600 V, and 1200 V, offering flexibility for different testing scenarios.
Target Applications
The IT8100A/E Series is ideal for testing:
- AI server power supplies and GPU systems
- High-power DC charging stations
- Fuel cell stacks and systems
- Data center power infrastructure
- Renewable energy converters and industrial power electronics
Thanks to its excellent dynamic response and scalability, the platform can accurately simulate rapid load changes and peak power conditions typical in modern high-performance computing and electrification applications.
The new series strengthens ITECH’s position in the high-power testing market, providing engineers with a powerful, flexible, and efficient solution for next-generation power validation needs.
Source: Electronics For You