At CES 2026, Infineon Technologies has revealed a new chip family designed to streamline wireless connectivity for Internet of Things (IoT) devices. The AIROC ACW741x series is the first product in the industry to combine Wi-Fi 7, Bluetooth LE 6.0 and IEEE 802.15.4 Thread radios in a single device, while also supporting the Matter ecosystem for seamless interoperability.
This integrated approach consolidates the most used wireless standards into one compact solution, helping engineers cut down on design complexity, component count, and time spent on testing and certification. The ACW741x family is optimized for the 20 MHz Wi-Fi 7 category, which enhances connectivity for low-power IoT applications.
[Image: AIROC ACW741x board diagram or smart home applications]
With multi-link Wi-Fi support spanning 2.4 GHz, 5 GHz, and 6 GHz bands, the chip improves connection reliability even in congested wireless environments. The 1x1, 20 MHz implementation also enables lower cost and power consumption compared to higher bandwidth configurations, making it ideal for battery-powered devices.
Bluetooth LE 6.0 features include channel sounding, which can support ranging and position awareness, while IEEE 802.15.4 Thread brings mesh networking capabilities that Matter-enabled products use for secure and scalable smart-home connectivity.
Target use cases include smart locks, security cameras, thermostats, home appliances, and industrial or medical IoT devices. Infineon says the ACW741x devices are now available in sample quantities, and development kits and software support are ready for engineers looking to adopt the new platform.