Archive : October 2017 год

Xilinx has started shipping its Zynq UltraScale+ RFSoC family to lead customers. According to the company, the parts represent a breakthrough architecture in which the RF signal chain has been integrated into an SoC with applications such as 5G wireless and radar.Based on 16nm UltraScale+ MPSoC architecture, the RFSoCs integrate RF data convert...

A photonic integrated chip developed by researchers from the Institute of Telecommunications and Multimedia Applications (iTEAM) at the Universitat Politècnica de València and the Optoelectronics Research Centre at the University of Southampton is said to behave similarly to a microprocessor. According to the team, just like the hardw...

Belgian nanotechnology research centre imec has developed a pressure sensor based on micro-optomechanical systems (MOMS) technology. The device is said to exhibit excellent measurement precision over a large pressure range while being compact, resistant to EMI. Applications are expected to include high-quality sensing, particularly in the medical a...

Design house, Plextek RFI, has announced that it has developed a multi-chip module (MCM) to cover the recently-designated European ‘Pioneer Band’ for millimetre-wave (mmWave) 5G around 26GHz.The development of the Front-End Module (FEM) was carried out in collaboration with Filtronic Broadband.“The band 24.25 to 27.5GHz wa...

Some 66% of thermal engineers must wait at least a day for their thermal simulations to solve. That’s according to the new State of Thermal report from 6SigmaET, which asked 170 thermal engineers in the electronics industry – including users of nine of the top thermal simulation suites - to share their views on thermal simulation.Th...