congatec has introduced the conga-TC300, a COM Express Type 6 Compact module designed as an entry-level edge AI solution. Powered by Intel Core Series 3 “Wildcat Lake” processors (up to the hexa-core Core 7 350), the module delivers a strong balance of performance, AI capabilities, and power efficiency at 15W TDP for demanding embedded applications.
congatec conga-TC300 COM Express Type 6 Compact module with Wildcat Lake processor
Processor Options
- Intel Core 7 350: 6 cores (2P + 4E), up to 4.6 GHz, 21 TOPS GPU, 17 TOPS NPU
- Intel Core 5 320: 6 cores, up to 4.6 GHz, 20 TOPS GPU, 16 TOPS NPU
- Intel Core 3 305: 6 cores, up to 4.3 GHz, 9 TOPS GPU
Key Specifications
- Up to 64 GB DDR5-6400 SO-DIMM memory
- Optional onboard UFS 3.1 storage
- Intel i226 2.5GbE controller with TSN support
- Display interfaces: up to 2x DDI (shared with USB4), LVDS or eDP
- Up to 2x USB4, 4x USB 3.2 Gen2, up to 8x USB 2.0
- PCIe: 4x Gen4 + optional 4x Gen3
- TPM 2.0 security, congatec Board Controller
- Dimensions: 95 × 95 mm (COM Express Compact)
Block diagram of congatec conga-TC300 COM Express module
Target Applications
The conga-TC300 is ideal for cost-sensitive edge AI applications including:
- Industrial automation and robotics
- Medical equipment
- Transportation and smart cities
- Retail / Point-of-Sale (POS) systems
It serves as a strong upgrade path from older Intel Atom or Celeron-based designs that now require dedicated AI acceleration.
The module supports Windows 11 IoT, Ubuntu Pro Linux, and various real-time/hypervisor solutions. Evaluation is possible with the conga-TEVAL carrier board.
conga-TEVAL COM Express carrier board for module evaluation
Source: CNX Software