RadioRadar - Datasheets, service manuals, circuits, electronics, components, CAD
Sitemap
Russian version
You read:

Latest Electronics News and Product Design Updates from New Electronics

 
Electronics News

Archive : 22 December 2014 год


20:10'High rise' 3D chips are ready for Big Data

In a development which could help address the current data processing limitations of today's technology, a team of Stanford engineers has pioneered a scalable 3D computer chip that interconnects logic and memory.

The researchers believe that with further work, the advance could enable large amounts of data to be processed quickly and more efficiently. 

The approach involves building layers of logic atop layers of memory to create a tightly interconnected 'high rise' chip. According to lead researcher Subhasish Mitra, the sheer number of short distance connections would allow the data to travel much faster, using less electricity, sidestepping the problem of bottlenecking almost completely. 

The innovation leverages three breakthroughs. The first is a new technology for creating transistors, while the second is a new type of computer memory that lends itself to multi-story fabrication. The third is a technique to build these new logic and memory technologies into high rise structures in a different way than previous efforts to stack chips. 

"This research is at an early stage, but our design and fabrication techniques are scalable," Mitra said. "With further development this architecture could lead to computing performance that is much, much greater than anything available today."

Author
Laura Hopperton

Source:  www.newelectronics.co.uk

20:05Qualcomm, EE and Huawei test LTE Category 9

Huawei, EE and Qualcomm have partnered for an LTE category 9 interoperability trial, claiming to have achieved download speeds of up to 410Mb/s.

According to the partners, this represents a significant step forward in the industry's attempt to improve download speeds and reliability. 

Testing was conducted using QTI's Qualcomm Snapdragon 810 processor and Huawei's commercial infrastructure solution, across EE's LTE-A 4G+ network. 

"We are excited to work with EE and Huawei in ushering in the latest evolution of wireless connectivity," said Enrico Salvatori, senior vice president of Qualcomm Europe. "Transitioning from Category 6 to Category 9 LTE-A connectivity will mean 1.5x faster peak download speeds, swift application response times, reliable connectivity and connections to the fastest networks."

Author
Laura Hopperton

Source:  www.newelectronics.co.uk

Electronic Components Distributor - HQonline Electronics