Electronics News and Product Design Updates
15.10.2017 - 23:12
As part of the CarriCool project, Fraunhofer researchers have worked with IBM to develop what is said to be an effective method for cooling processors. According to the team, by integrating microchannels into the silicon interposer, a significant increase in performance can be achieved. Meanwhile, the team has also integrated passive components ...
Analog Devices, imec to take IoT devices to ‘next generation’
15.10.2017 - 23:06
Belgian research centre imec is to work with Analog Devices to develop the next generation of IoT devices. The move, building on two existing initiatives, is intended to produce devices that are not only low-power, but which also feature largely improved or completely new sensing capabilities. One joint research initiative already underway fo...
Teledyne e2v sensors to equip the LSST
15.10.2017 - 22:57
Teledyne e2v has been awarded a multimillion dollar contract by SLAC National Accelerator Laboratory (SLAC) to supply customised Charge Coupled Device (CCD) image sensors for the Large Synoptic Survey Telescope. The 8.4 metre telescope is being constructed in Chile to carry out a ten-year survey of the sky to address a range of fundamental as...
XMOS launches development kit for Amazon Alexa Voice Service
15.10.2017 - 22:48
XMOS has announced the launch of the VocalFusion 4-Mic Dev Kit for the Amazon Alexa Voice Service (AVS). Said to be the first far-field linear mic array solution available on the market, the kit has been designed for developers who are looking to integrate Alexa into smart panels, kitchen appliances, and other commercial and industrial electr...
Scientist get closer to solving the 'speed limit' for electronic devices
08.10.2017 - 08:01
Scientists at Heriot-Watt University have reported they are one step closer to developing a technology that could result in electrons being replaced with photons, solving the looming ‘speed limit’ for electronic gadgets. According to Dr Marcello Ferrera, an assistant professor in Photonics and Optics at Heriot-Watt, the long-term ...
SoCs shipping with integrated RF signal chain
08.10.2017 - 07:52
Xilinx has started shipping its Zynq UltraScale+ RFSoC family to lead customers. According to the company, the parts represent a breakthrough architecture in which the RF signal chain has been integrated into an SoC with applications such as 5G wireless and radar. Based on 16nm UltraScale+ MPSoC architecture, the RFSoCs integrate RF data conv...
Integrated photonic chip is programmable
07.10.2017 - 23:45
A photonic integrated chip developed by researchers from the Institute of Telecommunications and Multimedia Applications (iTEAM) at the Universitat Politècnica de València and the Optoelectronics Research Centre at the University of Southampton is said to behave similarly to a microprocessor. According to the team, just like the ha...
Imec unveils MOMS based pressure sensor
07.10.2017 - 23:39
Belgian nanotechnology research centre imec has developed a pressure sensor based on micro-optomechanical systems (MOMS) technology. The device is said to exhibit excellent measurement precision over a large pressure range while being compact, resistant to EMI. Applications are expected to include high-quality sensing, particularly in the medica...
Plextek RFI and Filtronic Broadband develop multichip module for 5G
07.10.2017 - 23:34
Design house, Plextek RFI, has announced that it has developed a multi-chip module (MCM) to cover the recently-designated European ‘Pioneer Band’ for millimetre-wave (mmWave) 5G around 26GHz. The development of the Front-End Module (FEM) was carried out in collaboration with Filtronic Broadband. “The band 24.25 to 27.5GHz...
Report finds thermal engineers relying on outdated processes
07.10.2017 - 23:26
Some 66% of thermal engineers must wait at least a day for their thermal simulations to solve. That’s according to the new State of Thermal report from 6SigmaET, which asked 170 thermal engineers in the electronics industry – including users of nine of the top thermal simulation suites - to share their views on thermal simulation. ...
- - June