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Latest Electronics News and Product Design Updates from New Electronics

 
Electronics News


Arduino upgrades its Create Cloud platform to enable Linux based IoT devices
06.11.2017 - 23:42
Arduino has released a set of new features for its Create Cloud platform aimed at expanding the number of Arduino supported platforms for the development of IoT applications.Following this release Arduino Create Cloud users will now be able to programme Linux boards as if they were regular Arduino boards. Multiple Arduino programmes can run sim...
Structured light beams create new optical opportunities
06.11.2017 - 23:33
Structured beams of light which exhibit strange behaviour could have such applications as super-resolution imaging and communications, according to researchers the Harvard School of Engineering and Applied Sciences, who have have developed a tool to generate new states of light in a different way.“We have developed a metasurface; a new to...
Flexible THz detector uses graphene transistors
06.11.2017 - 23:15
Researchers at Chalmers University of Technology have developed a flexible detector for terahertz frequencies which features graphene transistors on plastic substrates.The device, said to be the first of its kind, has the potential to extend the use of terahertz technology to applications that will require flexible electronics, such as wire...
SiFive, Flex Logix look to boost custom silicon starts
06.11.2017 - 23:04
An agreement between SiFive and Flex Logix will see the latter’s EFLX embedded FPGA technology available for use in the SiFive Freedom Platform as part of the DesignShare programme. According to the partners, this will reduce time to market and remove some of the barriers that have blocked smaller companies from developing custom silicon....
Diamond based MOSFET features deep depletion
28.10.2017 - 23:29
Wide bandgap semiconductors, seen as significantly more energy-efficient, have emerged as leading contenders in the creation of FETs for next-generation power electronics.While diamond is believed to be the most ideal wide band gap material, one of the challenges in creating diamond MOSFETs is increasing the hole channel carrier mobility. Howev...
‘Flexible microcontroller’ unveiled at ARM TechCon
28.10.2017 - 23:26
Flex Logic has demonstrated an initial version of what it calls a flexible microcontroller design. The approach, unveiled at ARM TechCon, integrates an embedded FPGA on MCU processor and peripheral buses. This, says the company, will enable ‘unprecedented improvements in performance, cost and time to market for next generation chips’....
Intel starts shipments of Stratix 10 SX SoC FPGAs
28.10.2017 - 23:21
Intel has started shipping the Stratix 10 SX FPGA. The device, which integrates a quad-core ARM Cortex-A53 processor and features more than 1million logic elements, is said to suit 5G wireless communication, software defined radio, secure computing for military applications, network function virtualisation and data centre acceleration.“Wi...
Crossover processors to empower edge devices
28.10.2017 - 23:16
NXP says it is creating a new category called the crossover processor with the introduction of the RT1050, a device said to blend the benefits of applications processors with those of microcontrollers.Geoff Lees, general manager of NXP’s microcontroller business, said the i.MX RT is intended for edge processing applications. “NXP se...
Car maker evaluating BrainChip’s accelerator board
28.10.2017 - 23:06
Artificial intelligence and machine learning specialist Brainchip says it has shipped a BrainChip Accelerator card to a major European automobile manufacturer.Bob Beachler, senior vice president for marketing and business development, said: “This is an exciting first evaluation of BrainChip Accelerator. Our spiking neural network provides...
Microchannels cool high performance processors
15.10.2017 - 23:12
As part of the CarriCool project, Fraunhofer researchers have worked with IBM to develop what is said to be an effective method for cooling processors. According to the team, by integrating microchannels into the silicon interposer, a significant increase in performance can be achieved. Meanwhile, the team has also integrated passive components for...

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