Electronics News

Electronics News and Product Design Updates



Research could enable higher performance from OLEDs
08.01.2016 - 20:16

Organic LEDs are attractive not only because they emit light in all observation directions, but also for their colours and high contrast. It is also possible to manufacture transparent and flexible OLEDs, enabling new applications. OLEDs consist of ultra thin layers of organic materials – the emitter – between two electrodes. When...



Mid infrared laser and integrated with on chip amplifer
08.01.2016 - 20:12

A team from Northwestern University in the US claims it has made the laser simpler and more versatile by integrating a mid infrared tunable laser with an on chip amplifier. The development is said to allow an adjustable wavelength output, modulators and amplifiers to be held inside a single package. According to the team, the laser has demons...



PowerVR graphics family extended
08.01.2016 - 20:09

Imagination Technologies has extended its Rogue graphics architecture with the addition of two GPUs. The devices, part of the PowerVR Series7XT Plus family, are said to be aimed at the premium and mid-range segments of the consumer electronics market. Peter McGuinness, director of multimedia technology marketing, said: “We’re roll...



CPI and Beneq collaborate to commercialise ALD technologies
08.01.2016 - 20:05

The Centre for Process Innovation (CPI) and Beneq have signed a long term collaboration agreement for the use of atomic layer deposition (ALD) technologies in printable electronics applications. The agreement brings together Beneq’s high precision vacuum coating alongside CPI’s capability in the scale up of printed electronics. Wo...



Transparent electrode could boost touchscreen performance
08.01.2016 - 20:02

Researchers at ETH Zurich have used a 3D print technology called Nanodrip to create a new type of transparent electrode, which takes the form of a grid made of gold or silver ‘nanowalls’ on a glass surface. The electrode is to have a higher conductivity and to be more transparent than those made of indium tin oxide, the material c...



Carbon nano technology enables miniaturised optical devices
08.01.2016 - 19:59

A team of researchers from the University of Surrey’s Advanced Technology Institute (ATI) has grown vertically aligned carbon nanotubes (CNTs), in a grid-like formation on glass. The CNTs create wafer-thin, flat structures that could enable the miniaturisation of a range of optical devices. Removing the need for traditional curved refracti...



Bringing gesture recognition to embedded VR platforms
07.01.2016 - 23:52

Inuitive and Gestigon are collaborating to bring gesture recognition to embedded virtual reality (VR) platforms. The first stage of this collaboration will be demonstrated by both companies at CES 2016 in Las Vegas. Moritz Grotthuss, CEO of Gestigon, said: “Using today’s head-mounted VR displays, my hands are either not visible, o...



77GHz radar chip to enable next gen ADAS
07.01.2016 - 23:48

Said to be the smallest such device, a single chip 77GHz radar transceiver from NXP is claimed to enable the ‘next generation’ of radar sensor assemblies and to accelerate the adoption of advanced driver assistance systems (ADAS). The device, which measures 7.5 x 7.5mm, allows systems to be integrated ‘invisibly’ pract...



Quad core processor for high end routers
06.01.2016 - 21:23

Broadcom has launched a 64bit quad core processor for high end routers at CES. According to the company, the BCM4908 – which will be made on a 28nm process – enables OEMs and service providers to deliver the extra CPU power needed for smart home and IoT applications, whilst enabling higher Internet speeds. The BCM4908, which inclu...



Chinese company claims smallest WiFi SiP module
05.01.2016 - 23:33

Longsys Technology has used CES in Las Vegas to announce what it says is the smallest IoT WiFi silicon in package (SiP) module. The LTP0201 is designed for use in IoT and wearable devices that can connect to other smart devices or connect directly to the Internet. Measuring 6 x 6mm, the module integrates a 32bit RISC MCU, SRAM, SPI NOR flash,...



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