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Toshiba announces next generation RF SOI process
22.11.2015 - 23:30

Toshiba has developed a next generation TarfSOI (Toshiba advanced RF SOI) process optimised for radio-frequency (RF) switch applications. According to Toshiba RF switch ICs fabricated using the new TaRF8 process are able to achieve an insertion loss of just 0.32dB at 2.7GHz. Compared to products using Toshiba’s current TaRF6 process, th...

NGI and Alpha collaborate to develop next generation electronic materials
22.11.2015 - 23:27

Electronic soldering and bonding materials supplier, Alpha has announced a collaborative partnership with the National Graphene Institute (NGI) at The University of Manchester to develop the next generation of graphene-based electronic materials. James Baker, graphene business director at The University of Manchester said: "This collabor...

Acquisition of CMOSIS expands ams’ optical sensor portfolio
22.11.2015 - 23:24

Analogue and sensor specialist, ams has acquired CMOSIS in a €220million deal. According to ams, the acquisition will expand its optical sensor portfolio and market leadership in the Industry 4.0, IoT and medical diagnostics markets. CMOSIS’ image sensors serve a range of high-end applications in diverse markets including machine v...

Digi-Key and Accelerated Designs partner to provide symbols and footprints for millions of components
22.11.2015 - 23:21

Digi-Key Electronics has announced an exclusive, global agreement to distribute software and design data from Accelerated Designs. Accelerated Designs focuses on providing EDA-tool-neutral software and data to engineers and electronics manufacturers that improves the efficiency of adding and managing new parts when designing circuits and printed...

Silicon photonics project says three platforms available to fabless companies
22.11.2015 - 23:18

At the halfway stage of a four year project intended to build a European-based supply chain in silicon photonics, PLAT4M says it has now developed three technology platforms and adds these are available to a range of fabless companies. PLAT4M, which has received €10.2million of EC funding, brings together 15 companies, including European...

Wireless MCU for sub GHz applications
22.11.2015 - 23:16

Texas Instruments has added the CC1310 wireless microcontroller to its SimpleLink portfolio. The sub GHz device is said to enable extended battery life, longer range and enhanced integration. Featuring an ARM Cortex-M3 core and a sensor controller, the device is said to have the ability to communicate over distances as far as 20km. Running...

Manufacturing 3D nanostructures provides new opportunities for chips
22.11.2015 - 23:13

Scientists at the University of Twente's MESA+ research institute have developed a manufacturing method to create 3D nanostructures. This discovery is claimed to make it possible to produce chips with additional functions for mobile devices, computers and other applications. The conventional method for manufacturing 3D nanostructures cons...

Element14 becomes largest global ARM distributor
22.11.2015 - 23:10

As a result of an Asia-Pacific franchise agreement with ARM, element14 claims to have become the largest global distributor of ARM development tools, software, evaluation boards and debug hardware. The agreement also extends an existing Americas and EMEA franchise agreement between the two companies. Robin Colman, global head of software busi...

Palladium Z1 ushers in ‘new era of emulation’
21.11.2015 - 23:56

In a move that enables chip companies to emulate designs with up to 9billion gates, Cadence Design Systems has unveiled the Palladium Z1 enterprise emulation platform. The device, described as the industry’s first datacentre class emulation system, is said to be capable of delivering up to 5x greater emulation throughput than its predecess...

DSP cores targeted at low end IoT wireless apps
21.11.2015 - 23:05

Two power and cost optimised communication processors from CEVA have been designed to address the growing demand for multimode connectivity solutions for Internet of Things and M2M applications. The CEVA-XC5 and CEVA-XC8 DSP vector processors are the smallest and most power-efficient members of the CEVA-XC architecture, supporting a range of ...

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