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Latest Electronics News and Product Design Updates from New Electronics

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Flexible SMA Cable Assemblies Designed for Compact RF Systems
19.05.2026 - 14:21
Pasternack introduces new flexible SMA cable assemblies optimized for space-constrained RF and microwave applications with excellent phase stability up to 18 GHz
Compact DC-DC Converters Simplify Industrial Power Designs
18.05.2026 - 09:07
RECOM introduces new compact DC-DC converters designed to simplify industrial power designs with high efficiency, wide input range, and robust performance
Littelfuse Introduces Low-Profile TVS Diodes for Superior Power Protection
15.05.2026 - 09:22
Littelfuse introduces new low-profile TVS diodes designed for superior power and ESD protection in space-constrained consumer, automotive, and industrial electronics
Taoglas Launches Compact Multi-Connectivity Antennas for IoT and Connected Devices
14.05.2026 - 14:40
Taoglas introduces FXP30x (flexible) and PC30x (rigid) compact antennas supporting Cellular, GNSS, and Wi-Fi for space-constrained IoT and connected devices
pSemi Launches New Power Solutions for Fast Charging and Robotics
13.05.2026 - 12:26
pSemi launches new high-efficiency power components — PE26100 for fast mobile charging and PE25304 for robotics and industrial 48V systems
Brain-Like Chips Could Dramatically Save Energy for AI
11.05.2026 - 09:51
Brain-like neuromorphic chips could solve AI’s massive energy problem by combining memory and processing like the human brain, according to new research from University of Missouri
Diodes Incorporated Launches 32Gbps ReDriver for Next-Gen Smart Cockpits
08.05.2026 - 17:15
Diodes Incorporated introduces a new 32Gbps four-channel linear ReDriver optimized for PCIe 5.0, SAS4, and CXL, targeting next-generation AI-powered automotive smart cockpits.
SiGe Chip Hits 500 Gbps Barrier - Major Breakthrough in High-Speed Data Transmission
06.05.2026 - 12:01
SiGe chip from Paderborn University breaks 500 Gbps barrier, promising major advances in data center interconnects and high-performance computing
congatec conga-TC300 COM Express Module Features Intel Core 7 350 Wildcat Lake Processor
05.05.2026 - 10:04
congatec launches conga-TC300 COM Express Type 6 module with Intel Core Series 3 Wildcat Lake processors up to Core 7 350 for entry-level edge AI applications
ITECH Launches IT8100A/E Series High-Power DC Electronic Loads for AI and Data Center Testing
05.05.2026 - 09:36
ITECH launches IT8100A/E Series high-power DC electronic loads up to 1.8 MW with ultra-fast 150 A/μs slew rate. Designed for AI server power supplies, GPU testing, data centers, and EV charging systems