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Latest Electronics News and Product Design Updates from New Electronics

 
Electronics News

Archive : 24 October 2007 год


08:42Digital camera modules

Toshiba Electronics Europe (TEE) has announced a line of camera modules featuring its Dynastron image sensor technology. This family of camera modules, which includes the TCM9200MD, TCM9100MD and the TCM9000MD, were developed using Toshiba’s chip scale camera module (CSCM) manufacturing technology and are the first to use through chip via (TCV) technology. CSCM allows mounting and assembly of camera module components during Toshiba’s wafer manufacturing process. This delivers an approximate 64 percent reduction in module size in comparison to other modules using the same sensor.

In addition to allowing camera module components to be integrated in the wafer, Toshiba’s TCV technology uses a chip structure with built-in pass through electrodes and solder balls on the rear of the wafer. Accordingly, CSCM camera modules have tighter pixel pitch leads and require no wire bonding space, yielding a smaller overall module size. Mass production for the TCM9200MD, TCM9100MD and TCM9000MD camera modules is planned for January, February and June 2008 respectively.


08:39Transformers for Analog Devices ADM2485
Murata Power Solutions has announced a series of transformers that simplify implementation of isolated RS-485 and RS-422 interfaces based on Analog Devices chipsets by eliminating the need to select, compare and test alternative solutions.

 Features

    Transformers recommended by Analog Devices for use with ADM2485 transceiver
    Low profile device offers 2.5kVrms isolation and industrial temperature operation
    Accurately controlled turns ratio for consistent performance
    Toroidal construction maximises efficiency and reduces EMI

 Each device in the 782485 converter transformer series has been specifically designed for use with the Analog Devices ADM2485 high speed, isolated differential bus RS-485 transceiver. Fully approved by Analog Devices, the transformers are also recommended in the company’s ADM2485 datasheets and reference design documentation. The transformers are supplied in a low profile (6.35mm), fully encapsulated package with an industry standard DIL pinout. Surface mount versions will be available soon. Incorporating an internal transformer driver, the Analog Devices ADM2485 is deployed in isolated RS-485 and RS-422 interfaces as well as Profibus networks, industrial field networks and multipoint data transmission systems. Combining the device with a Murata Power Solutions 782485 transformer, an LDO regulator and a small number of discrete components allows designers to implement a fully isolated 5V power supply.

08:37MicroTCA-Compliant JTAG Multiplexer
Maxim Integrated Products introduces the DS26900 JTAG signal multiplexer with secondary port autodetection. As MicroTCA-compliant single-chip solution, the DS26900 provides 3 arbitrated master ports and 18 independent secondary ports, which can be cascaded for up to 36 secondary ports. This device provides port autodetection that allows the master to detect device presence on secondary ports, as well as transparent communication between an arbitrated master and a selected secondary port. The DS26900 is ideal for MicroTCA applications, AdvancedMC carrier blades, system-level diagnostics, test equipment, board-level JTAG applications, and ATCA applications. A solution for star architecture JTAG, the DS26900 also features two 32-bit scratchpad registers, internal pullup/pulldown resistors, and operation up to 50MHz. This device is available in a leaded or lead-free, tiny, 20mm x 20mm, 144-pin LQFP package. It is fully specified over the -40°C to +85°C extended temperature range. Pricing starts at $6.50 (10,000-up, FOB USA).

08:35SMIC adopts HFSS-based library from Ansoft
Semiconductor Manufacturing International Corporation (SMIC), a semiconductor foundry, announced its commitment to Ansoft Corporation's HFSS simulation technology for S-parameter extraction, frequency-dependent SPICE model extraction and EMI prediction. SMIC's adoption of HFSS extends its RF CMOS design capabilities and provides a proven platform on which to build accurate and traceable on-chip model libraries. SMIC will use HFSS to provide a unique library of complex, high-speed and high-frequency passive structures for accurate, next-generation designs traceable to the foundry. In addition, SMIC is investigating new design flows that link process-accurate models of critical, multi-port structures with advanced circuit and system simulation.

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