Archive : 22 November 2007 год

Maxim Integrated Products introduces the MAX8671X power-management IC (PMIC). This device provides a single-cell, lithium-ion (Li+)/lithium-polymer (Li-Poly) charger with proprietary Smart Power Selector circuitry that seamlessly distributes power within the system. To reduce BOM cost, the MAX8671X integrates three 2MHz, step-down DC-DC converters and two low-quiescent-current linear regulators that are capable of providing five regulated output voltages. A complete power-management solution for battery-operated devices, this PMIC is dedicated for use in smartphones, PDAs, portable media players/MP3 players, GPS navigation devices, digital still/video cameras, and other portable handheld devices. The MAX8671X's Smart Power Selector circuitry efficiently distributes power between a USB/AC-adapter source, battery, and system load.

 When external power is connected, the Smart Power Selector allows the system to operate with no battery or a deeply discharged battery. It automatically switches the system load from the battery and makes the best use of limited USB or adapter power while charging the battery from input power not used by the system. Featuring 16V-tolerant, dual (USB and AC-to-DC) power inputs, the MAX8671X supports end products with dual or single power connectors. All necessary power switches and current-sense circuitry are included on the chip—no external MOSFETs are required. The Smart Power Selector also provides thermal-limiting circuitry that reduces the battery-charge rate to prevent the charger from overheating. The MAX8671X is available in a thermally enhanced, 5mm x 5mm, 40-pin TQFN package that is fully specified over the -40°C to +85°C extended temperature range. Prices start at $2.95 (1000-up, FOB USA). An evaluation kit is available to speed designs.

Farnell has introduced a new packaging solution for Integrated Circuits. Peel packaging offers complete protection to each individual component in transit, storage and handling by placing them within a protective, recyclable and biodegradable plastic cell which is then sealed with an anti-static lid. Peel packaging has been developed by Farnell in conjunction with Antistat. Initially, over 800 of Farnell’s most popular ICs with case sizes between 7mm x 7mm and 10mm x 10mm are being offered with the new packaging as standard. Product categories include: amplifiers, A to D converters, D to A converters, microcontrollers, and processors. Subsequent phases of the program will see peel packaging extended to a significant portion of the company’s complete IC product range.