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Latest Electronics News and Product Design Updates from New Electronics

 
Electronics News

Archive : 2015 год



22.07.2015 - 22:46
Microchip has announced two eight-bit families that expand its growing portfolio of PIC MCUs with Core-Independent Peripherals (CIPs). Eight-bit MCUs can be used in a broader range of applications, due to the growing number of these intelligent, interconnected CIPs that combine to perform functions autonomously, without the core.Because these f...
21.07.2015 - 23:37
The Weightless SIG has announced that M²Communication (M2COMM) has joined the Weightless SIG to lead a Weightless Working Group for the development of a high performance LPWAN Standard.The Weightless-P Standard is said to offer uplink and downlink capabilities to enhance quality of service, which is especially important in the industrial I...
20.07.2015 - 21:04
Engineers at the University of California, in collaboration with colleagues at Taiwan's National Chiao Tung University, have integrated electrical components, such as resistors, inductors, capacitors and integrated wireless electrical sensing systems into the 3D printing process. They have put the new technology to the test by printing a wirele...
20.07.2015 - 21:01
In a move which broadens its support for processor core debug, UltraSoC has added Cadence's Tensilica Xtensa family to its UltraDebug package."UltraSoC has innovative technology when it comes to SoC debug," said Chris Jones, product marketing group director of the Tensilica division of the IP Group at Cadence. "Its technology...
20.07.2015 - 20:58
As part of the £100million for research into intelligent mobility announced by the Chancellor in the Spring 2015 Budget, the government has launched a £20m competitive fund for collaborative research and development into driverless vehicles, along with a code of practice for testing.The measures announced by Business Secretary Sajid...
20.07.2015 - 20:52
Researchers from North Carolina State University and Brown University have found that zinc oxide and silicon nanowires have a pronounced anelasticity. This could enable the development of stretchable, flexible wearable devices.It was found that – when bent – the nanowires would return more than 80% of the way to their original shape...
20.07.2015 - 20:48
RS Components (RS) claims it is making energy-harvesting applications easier and faster to develop with the Wireless Switch Evaluation Kit and modular snap and rocker switches by Cherry.The AFIK-1002 evaluation kit is said to contain everything needed to setup wireless links using self-powered switches, and to test key parameters such as signal...
20.07.2015 - 20:45
TSMC hasn't given up hope on using EUV lithography at the 10nm node, but it appears to be more likely to be introduced at the 5nm node. Speaking on a conference call, Mark Liu, TSMC's president and co-CEO, pictured, said: "We are planning to exercise EUV at 7nm and are currently planning to use EUV at 5nm. But it depends on certain dev...
20.07.2015 - 20:42
Renesas Electronics has developed the RL78/G1D Group of MCUs that combines Bluetooth Low Energy technology with the RL78 MCU. The MCUs are claimed to Extend Battery Life and simplify circuit design.The current consumption of the RL78/G1D is claimed to be the lowest in the industry at 3.5mA during reception and 4.3mA during transmission. Adaptab...
16.07.2015 - 22:34
Digi-Key has announced their partnership with the ARM University Programme to distribute 'Lab-in-a-Box' (LiB) to higher educational institutions around the globe.The LiB contains ARM-based technology and high quality, rigorous training materials that support electronics and computer engineering courses. Since its launch in February 2014...

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