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Latest Electronics News and Product Design Updates from New Electronics

 
Electronics News

Archive : January 2016 год



20.01.2016 - 23:17
FlexEnable and ISORG, specialists in flexible organic electronics and organic photodetectors and large area image sensors in printed electronics respectively, have unveiled the world’s first large area flexible fingerprint sensor on plastic designed for biometric applications.With a thickness of 0.03cm, an 8.6 x 8.6cm active area, 84&micr...
20.01.2016 - 23:15
Following the launch in 2015 of embedded SRAM IP for 28nm fully depleted silicon on insulator (FD-SOI) process technology, Sheffield based sureCore has now unveiled a memory compiler for the process.The compiler is said to allow designers to trade off the number of words, word length and multiplex factor. Supporting single and dual port SRAM IP...
18.01.2016 - 23:52
A team of neurosurgeons at Washington University School of Medicine in St.Louis and engineers at the University of Illinois has developed wireless brain sensors that monitor intracranial pressure and temperature and then are absorbed by the body, negating the need for surgery to remove them.Such implants could be used to monitor patients with t...
18.01.2016 - 23:49
A research team from Japan, led by Takashi Sekiguchi of the Nano-Electronic Materials Unit, International Centre for Materials Nanoarchitectonics and Koichi Kakimoto, a professor at the Research Institute for Applied Mechanics, Kyushu University, has developed a method to grow high-quality mono silicon at low cost.The research resulted in a cas...
18.01.2016 - 23:46
Researchers at the Cockrell School of Engineering at The University of Texas at Austin have developed a device and technique called bubble-pen lithography, which can handle nanoparticles, tiny pieces of gold, silicon and other materials used in nanomanufacturing, without damaging them. The method uses microbubbles to inscribe nanoparticles onto a s...
18.01.2016 - 23:42
German researchers at Technische Universität München (TUM) have studied how electronic interactions govern the encounter between a molecule called porphine and copper and silver surfaces.As electronic components continue to shrink, top-down manufacturing methods begin to approach a physical limit at the nanoscale. Rather than continue...
18.01.2016 - 23:37
AMD has launched the Opteron A1100 processor, which it is targeting at datacentre applications. The 64bit device, manufactured on what the company calls an optimised 28nm process, features up to eight ARM Cortex-A57 cores, as well as twin 10Gbit Ethernet ports.There are currently three members of the family planned – two of these will fea...
18.01.2016 - 23:35
Researchers at the University of Chicago and the US Department of Energy's Argonne National Laboratory claim to have found a way for the semiconductor industry to hit miniaturisation targets on time and without defects.The researchers’ technique includes creating patterns on semiconductor surfaces that allow block copolymer molecules...
18.01.2016 - 23:32
Researchers at the US Department of Energy’s Argonne National Laboratory are currently trying to find chemistries that could offer better energy possibilities. The researchers say that, of these chemistries, lithium-air could promise greater energy density.Previous work on lithium-air batteries has shown the same phenomenon: the formation...
14.01.2016 - 23:29
Samsung has announced that it has begun mass production of advanced logic chips utilising its 14nm LPP (Low-Power Plus) process, the second generation of the company’s 14nm FinFET process technology.In Q1 of 2015 Samsung launched the Exynos 7 Octa processor built on the industry’s first 14nm LPE (Low-Power Early) process. With the 1...

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