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Latest Electronics News and Product Design Updates from New Electronics

 
Electronics News

Archive : February 2016 год



24.02.2016 - 23:22
Scientists at the University of Southampton have made a major step forward in the development of digital data storage that is capable of surviving for billions of years.Using nanostructured glass, scientists from the University’s Optoelectronics Research Centre (ORC) have developed the recording and retrieval processes of five dimensional...
24.02.2016 - 23:20
A team of computer scientists and electrical engineers from the University of Washington claims to have generated Wi-Fi transmissions using 10,000 times less power than conventional methods. The Passive Wi-Fi system is also said to consume 1000 times less power than existing energy-efficient wireless communication platforms, such as Bluetooth Low E...
24.02.2016 - 23:18
Power Integrations and Cypress Semiconductor have announced a joint reference design describing a 20W, USB-PD compliant AC/DC power converter targeted at chargers for smart mobile devices. The design, titled DER-533, pairs the EZ-PD CCG2 USB Type-C port controller from Cypress with Power Integrations’ InnoSwitch-CP off-line CV/CC flyback swit...
23.02.2016 - 23:14
A business built on the premise of licensing IP can prove lucrative, as evidenced by ARM’s latest financial report. But when the number of deals signed declines, times can be tough, as Imagination Technologies has found out.ARM says its Q4 2015 revenues grew by 19% to £269.1million. In dollar terms, revenues rose by 14% to $407.9m....
23.02.2016 - 23:09
Looking to drive what it says is the ‘next wave of innovation in the embedded, wearables and IoT sectors, ARM has announced the Cortex-A32, the smallest device yet based on its v8 architecture. However, the part has been optimised for 32bit processing.Intended to provide an upgrade path for those using Cortex-A5 and A7 cores, the A32 is s...
23.02.2016 - 23:08
Researchers at Aalto University have fabricated an electricity conducting material combination with what they call ‘especially promising properties’ by merging graphene and gallium selenide to create a heterojunction.While many 2D structures that combine with graphene have been fabricated manually, the structure developed by Riikone...
23.02.2016 - 23:05
NXP is using Embedded World as a platform to boost the prospects of near field communications (NFC) technology in a range of applications.According to Rafael Sotomajor, SVP of NXP’s secure mobile transactions business, ‘the time is now’ for NFC, but he concedes that further work needs to be done to increase its acceptance. &ld...
23.02.2016 - 23:01
While analogue transmitters are less suitable for integration in advanced CMOS nodes, digital transmitters typically fall short when it comes to high-end performance parameters such as out-of-band noise and spurious emission.Belgian nanoelectronics research center imec and Vrije Universiteit Brussel claim to have overcome this with a transmitte...
17.02.2016 - 23:09
The first family in a range of SoCs intended to support 3D instrument clusters has been launched by Renesas. The R-Car D1 Series is intended to provide a smooth migration path for automotive system manufacturers as the use of colour LCD panels in instrument cluster systems becomes more widespread.In the future, the company believes, display siz...
17.02.2016 - 23:05
University of Utah engineers have discovered a 2D semiconducting material that could enable faster devices which consume less power.While researchers in this field have recently discovered 2D materials such as graphene, molybdenum disulphide and borophene, these only allow the movement of electrons. According to associate professor Ashutosh Tiw...