Archive : May 2026 год

SiGe chip from Paderborn University breaks 500 Gbps barrier, promising major advances in data center interconnects and high-performance computing

congatec launches conga-TC300 COM Express Type 6 module with Intel Core Series 3 Wildcat Lake processors up to Core 7 350 for entry-level edge AI applications

ITECH launches IT8100A/E Series high-power DC electronic loads up to 1.8 MW with ultra-fast 150 A/μs slew rate. Designed for AI server power supplies, GPU testing, data centers, and EV charging systems